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 Philips Semiconductors
Product specification
Triacs sensitive gate
GENERAL DESCRIPTION
Passivated, sensitive gate triacs in a full pack plastic envelope, intended for use in general purpose bidirectional switching and phase control applications, where high sensitivity is required in all four quadrants.
BT138X series E
QUICK REFERENCE DATA
SYMBOL VDRM IT(RMS) ITSM PARAMETER BT138XRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current MAX. 600E 600 12 95 MAX. 800E 800 12 95 UNIT V A A
PINNING - SOT186A
PIN 1 2 3 DESCRIPTION main terminal 1
PIN CONFIGURATION
case
SYMBOL
T2
main terminal 2 gate
123
T1
case isolated
G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current I2t for fusing Repetitive rate of rise of on-state current after triggering full sine wave; Ths 56 C full sine wave; Tj = 25 C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s T2+ G+ T2+ GT2- GT2- G+ CONDITIONS MIN. -40 -600 6001 12 95 105 45 50 50 50 10 2 5 5 0.5 150 125 MAX. -800 800 UNIT V A A A A2s A/s A/s A/s A/s A V W W C C
I2t dIT/dt
IGM VGM PGM PG(AV) Tstg Tj
Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature
over any 20 ms period
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s. June 2001 1 Rev 1.400
Philips Semiconductors
Product specification
Triacs sensitive gate
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from all three terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. 65% ; clean and dustfree MIN. -
BT138X series E
TYP. -
MAX. 2500
UNIT V
Cisol
Capacitance from T2 to external f = 1 MHz heatsink
-
10
-
pF
THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS full or half cycle with heatsink compound without heatsink compound in free air MIN. TYP. 55 MAX. 4.0 5.5 UNIT K/W K/W K/W
STATIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL IGT PARAMETER Gate trigger current CONDITIONS VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ T2+ G+ T2+ GT2- GT2- G+ MIN. 0.25 TYP. 2.5 4.0 5.0 11 3.2 16 4.0 5.5 4.0 1.4 0.7 0.4 0.1 MAX. 10 10 10 25 30 40 30 40 30 1.65 1.5 0.5 UNIT mA mA mA mA mA mA mA mA mA V V V mA
IL
Latching current
VD = 12 V; IGT = 0.1 A
IH VT VGT ID
Holding current On-state voltage Gate trigger voltage Off-state leakage current
VD = 12 V; IGT = 0.1 A IT = 15 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 C VD = VDRM(max); Tj = 125 C
DYNAMIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL dVD/dt tgt PARAMETER Critical rate of rise of off-state voltage Gate controlled turn-on time CONDITIONS VDM = 67% VDRM(max); Tj = 125 C; exponential waveform; gate open circuit ITM = 16 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s MIN. TYP. 50 2 MAX. UNIT V/s s
June 2001
2
Rev 1.400
Philips Semiconductors
Product specification
Triacs sensitive gate
BT138X series E
20
Ptot / W
Ths(max) / C = 180
45
15
IT(RMS) / A
BT138X
56 C
65
15
1
120 90 60
10
85
10
30
5
5 105
0
0
5 IT(RMS) / A
10
125 15
0 -50
0
50 Ths / C
100
150
Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where = conduction angle.
ITSM / A
Fig.4. Maximum permissible rms current IT(RMS) , versus heatsink temperature Ths.
IT(RMS) / A
1000
25
20
15
100 dI T /dt limit T2- G+ quadrant IT T 10 10us I TSM time
10
5
Tj initial = 25 C max 100us 1ms T/s 10ms 100ms
0 0.01
0.1 1 surge duration / s
10
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 20ms.
ITSM / A IT 80 T ITSM time
Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Ths 56C.
VGT(Tj) VGT(25 C)
100
1.6 1.4 1.2 1
Tj initial = 25 C max 60
40
0.8
20
0.6 0.4 -50
0
1
10 100 Number of cycles at 50Hz
1000
0
50 Tj / C
100
150
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj.
June 2001
3
Rev 1.400
Philips Semiconductors
Product specification
Triacs sensitive gate
BT138X series E
3 2.5 2 1.5 1 0.5
IGT(Tj) IGT(25 C) T2+ G+ T2+ GT2- GT2- G+
40
IT / A Tj = 125 C Tj = 25 C typ max
30
Vo = 1.175 V Rs = 0.0316 Ohms
20
10
0 -50
0
0
50 Tj / C
100
150
0
0.5
1
1.5 VT / V
2
2.5
3
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj.
IL(Tj) IL(25 C)
Fig.10. Typical and maximum on-state characteristic.
10
Zth j-hs (K/W) with heatsink compound without heatsink compound
3 2.5 2 1.5 1
1 unidirectional 0.1
P D tp
bidirectional
0.01
0.5 0 -50
0.001 10us 0.1ms 1ms 10ms tp / s 0.1s 1s
t
0
50 Tj / C
100
150
10s
Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj.
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance Zth j-hs, versus pulse width tp.
dVD/dt (V/us)
1000
3 2.5 2 1.5 1 0.5
100
10
0 -50
0
50 Tj / C
100
150
1
0
50 Tj / C
100
150
Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj.
Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj.
June 2001
4
Rev 1.400
Philips Semiconductors
Product specification
Triacs sensitive gate
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
10.3 max 3.2 3.0
BT138X series E
4.6 max 2.9 max
Recesses (2x) 2.5 0.8 max. depth
2.8 6.4 seating plane 15.8 max
15.8 max. 3 max. not tinned
19 max.
3 2.5 13.5 min. 1 0.4
M
2
3 1.0 (2x) 0.6 2.54 0.5 2.5 1.3 0.9 0.7
5.08
Fig.13. SOT186A; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8".
June 2001
5
Rev 1.400
Philips Semiconductors
Product specification
Triacs sensitive gate
BT138X series E
DEFINITIONS
DATA SHEET STATUS DATA SHEET STATUS2 Objective data PRODUCT STATUS3 Development DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in ordere to improve the design and supply the best possible product This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A
Preliminary data
Qualification
Product data
Production
Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2 Please consult the most recently issued datasheet before initiating or completing a design. 3 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. June 2001 6 Rev 1.400


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